Many legacy In-Circuit Testers (ICT) support some kind of boundary scan for structural testing, to address limited access issues. But are these as good as advertised?
In addition to board design/layout issues, manufacturing defects and variances, other factors such as pollution and power marginalities can affect a design’s signal integrity and subsequent performance.
Today’s flying probe testers can give high structural test coverage, making them ideal for prototype board bring-up and low-volume manufacturing. But they can be darned slow. Can boundary scan help?